This paper presents the design and development of a silicon-based three-axial force sensor to be used in a flexible smart interface for biomechanical measurements. Normal and shear forces are detected by combining responses from four piezoresistors obtained by ion implantation in a high aspect-ratio cross-shape flexible element equipped with a 525 m high silicon mesa. The mesa is obtained by a subtractive dry etching process of the whole handle layer of an SOI wafer. Piezoresistor size ranges between 6 and 10m in width, and between 30 and 50m in length. The sensor configuration follows a hybrid integration approach for interconnection and for future electronic circuitry system integration. The sensor ability to measure both normal and shear forces with high linearity (∼=99%) and low hysteresis is demonstrated by means of tests performed by applying forces from 0 to 2 N. In this paper the packaging design is also presented and materials for flexible sensor array preliminary assembly are described.

Design and fabrication of a hybrid silicon three-axial force sensor for biomechanical applications

BECCAI, LUCIA;ROCCELLA, STEFANO;VALDASTRI, Pietro;MENCIASSI, Arianna;CARROZZA, Maria Chiara;DARIO, Paolo
2005-01-01

Abstract

This paper presents the design and development of a silicon-based three-axial force sensor to be used in a flexible smart interface for biomechanical measurements. Normal and shear forces are detected by combining responses from four piezoresistors obtained by ion implantation in a high aspect-ratio cross-shape flexible element equipped with a 525 m high silicon mesa. The mesa is obtained by a subtractive dry etching process of the whole handle layer of an SOI wafer. Piezoresistor size ranges between 6 and 10m in width, and between 30 and 50m in length. The sensor configuration follows a hybrid integration approach for interconnection and for future electronic circuitry system integration. The sensor ability to measure both normal and shear forces with high linearity (∼=99%) and low hysteresis is demonstrated by means of tests performed by applying forces from 0 to 2 N. In this paper the packaging design is also presented and materials for flexible sensor array preliminary assembly are described.
2005
File in questo prodotto:
File Dimensione Formato  
beccai2005.pdf

non disponibili

Tipologia: Documento in Post-print/Accepted manuscript
Licenza: Non pubblico
Dimensione 634.77 kB
Formato Adobe PDF
634.77 kB Adobe PDF   Visualizza/Apri   Richiedi una copia

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11382/301778
Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus 164
social impact