Highly Integrated Low Power Sensor Node

The MEMS Sensor devices are in a very fast development era and the sensor-tile modules with multi-sensing functions are becoming a reality for system monitoring, especially in sensing matrix configurations. In particular, the focus on single package multi-sensing modules with Bluetooth® LE features are increasing their impact on several product areas. In wearable electronics, building management and bio-medical parameters monitoring environments, SiP (System in Package) approach with antenna set inclusion constitutes the leading solution in order to integrate a 2.45 GHz Bluetooth system. In the present paper we describe a novel packaging approach for integrating a plenitude of MEMS based sensors together with wireless connectivity and embedded processing power. The final component is characterized by small size and good RF performances.